Our Bondline range of thermal adhesive tapes are designed to mechanically fix two surfaces whilst delivering excellent thermal transfer.
The materials provide a cost effective means to thermally manage electrical assemblies and form a strong bond between surfaces. The adhesive within Bondline interface materials are designed to flow thus maximising thermal ‘wet out’ and improving thermal performance. Simple and easy to handle, Bondline materials can be supplied with release liners on one or both sides for easy removal and application.
Bondline exhibits:
- Strong contact adhesive for bonding insulated metal printed circuit boards to heat sinks
- Thermally efficient at transferring heat
- Electrical isolation, if required, guaranteed for bonding FR4 and other substrates to heat sinks
- The ability to bond irregular surfaces due to various thickness options
Universal Science manufactures custom-made shapes that are designed to suit design requirements. Bondline materials are available in sheet or roll format.
Benefits of Bondline:
- Removes the need for screws or fixings
- Cost-effective thermal management solution for mounting substrates to heat sinks
- Exceptional thermal performance via a strong mechanical bond between interfaces
- Thin bond lines between interfaces reduces thermal resistance and improves thermal performance
- Micro air-voids are removed at surfaces as a result of the flow action of the adhesive
- Electrical isolation if required
Bondline 200
Bondline 200
Bondline 200 is a thermally conductive, non-electrically isolating double sided structural adhesive tape. With excellent thermal properties the material is designed to attach two surfaces that require a strong bond. Constructed from a thin metal foil Bondline 200 consists of a strong adhesive which removes micro air-voids between interfaces and reduces thermal resistance to an absolute minimum. The material is cost effective in comparison to its high thermal performance and material can be applied quickly and simply.
Features and benefits:
- Thin strong bond between surfaces
- Thermal conductivity of 0.3W/mK
- Standard widths of 25, 30, 40, 50, 75 and 100mm. Any widths up to 300mm are also available. alternatives are available
- Can be supplied on 30m rolls and custom die or kiss cut to best suit design requirements
Typical applications include:
- LED lighting assemblies
- Automotive electronics
- Telecommunications
- Power supplies
Technical Datasheet
Bondline 300
Bondline 300
Bondline 300 is a thermally conductive, electrically isolating structural adhesive tape. most cost effective thermal adhesive. The material is formulated with adhesive on both sides and is designed to attach two surfaces together which require a strong bond, excellent thermal connection and electrical isolation. Micro air-voids are removed at the interface by the cold flow action of the adhesive resulting in the reduction of thermal resistance to an absolute minimum.
Features and benefits:
- Thin strong bond between surfaces whilst providing electrical isolation
- Thermal conductivity of 0.5W/mK and 0.12mm thickness
- Widths of 25, 30, 40 and 50mm; alternatives are available
- Can be supplied on 30m rolls and custom die or kiss cut to best suit design requirements
Typical applications include:
- LED lighting assemblies
- Automotive electronics
- Telecommunications
- Power supplies
Technical Datasheet
Bondline 700
Bondline 700
Bondline 700 is formulated to mechanically fix and thermally connect substrates such as FR4 or other electronic devices to a heat sink, cold wall, or chassis. Bondline 700 is designed for use in applications that require a combination of good thermal transfer, dielectric strength and conformability. Supplied on a liner and is easy to apply.
Features and benefits:
- Provides excellent adhesion for a variety of substrates
- Thermal conductivity of 0.5W/mK with 0.15mm thickness. Thermal conductivity of 1.0W/mK with 0.25mm and 0.5mm thicknesses
- Adhesive flows into irregular surface voids governed by the selection of the thickness of the material
- Can be supplied in rolls or sheets and in custom die cut parts to best suit design requirements
Typical applications include:
- Bonding FR4 and other PCB materials to heat sinks
- LED lighting assemblies
- Ceramic to metal, ceramic to ceramic or metal to metal bonding
- Mounting heat sink or heat spreader to IC packages and components
Technical Datasheet
Bondline 1000-REFLOW
Bondline 1000-REFLOW
Bondline 1000-REFLOW is formulated to mechanically bond FR4 and MPCBs to a heatsink or other nearby metal work. Its properties enable the material to be laminated to the PCB prior to fabrication, which removes an additional production process as PCBs can be supplied with a thermal interface material pre-applied.
Features and benefits:
- Provides excellent adhesion for a variety of substrates
- Thermal conductivity of 1.0W/mK and a standard thickness of 0.15mm.
- Formulated with acrylic adhesive and ceramic fillers for excellent thermal performance
- Laminated insulated MPCBs and FR4s can be baked without compromising interface material’s bond-strength or thermal performance
Typical applications include:
- Bonding FR4 and other PCB materials to heat sinks
- LED lighting assemblies
- Ceramic to metal, ceramic to ceramic or metal to metal bonding
- Mounting heat sink or heat spreader to IC packages and components
Technical Datasheet
Bondline 1800
Bondline 1800
Bondline 1800 is an electrically insulating, thermally conductive adhesive tape. Formulated with acrylic adhesive and ceramic fillers Bondline 1800 delivers a strong structural bond, ideal for mounting LED light engines to heatsinks. Comprised of pressure sensitive adhesive, Bondline 1800 will conform to surface imperfections between mating surfaces thereby obviating micro air-voids and reducing thermal resistance to a minimum.
Features and benefits:
- Provides excellent adhesion for a variety of substrates
- Thermal conductivity of 1.8W/mK with 0.2mm thickness.
- Adhesive flows into irregular surface voids governed by the selection of the thickness of the material
- Can be supplied in rolls or sheets and in custom die cut parts to best suit design requirements
Typical applications include:
- Bonding FR4 and other PCB materials to heat sinks
- LED lighting assemblies
- Ceramic to metal, ceramic to ceramic or metal to metal bonding
- Mounting heat sink or heat spreader to IC packages and components
Technical Datasheet
