Thermal Interfacing Theory

The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer.

More high power components in a smaller space means higher watt densities which translates to increased heat. As temperatures rise, the reliability of an electronic system can be dramatically impaired.

Universal Science likes to share it's knowledge in thermal management and a discussion guideline regarding heat transfer mechanisms from a component to a heat sink is offered below.

Every application will require a more detailed investigation into how best solve the thermal management issues. Your exact requirements can be discussed with our technical staff who will be pleased to assist.

Please see the download for the more detailed discussion on reducing thermal resistance across an interface: