Universal Science has an established history in two defined areas of operation; thermal management in electronic assemblies and LED lighting. Our over a decade long knowledge and understanding of both industries has enabled us to become the global organisation we are today.Read More
Universal Science works with many automotive related manufacturers and automotive electronics design engineers. This enables us to recognise the industry’s renowned demands for the highest level of quality and excellence. Products we supply extensively for use in automotive applications;
UniGap 1700US; an ultra-soft, vibration dampening, thermally conductive gap filling pad. Coupling heat generating components of various heights to cold wall or chassis.
UniPutty 1800; a one-part, automatically dispensable compound. Ideal for high volume applications where hot devices need a thermal connection to a cold wall or chassis with minimal application pressure.
LED lighting modules are used today in helicopter landing systems on board ships that are designed and built by Universal Science, through to thermal components used inside Airbus fuel pumps. Products used extensively within aerospace and military applications;
UniShield 6000 is a thermally conductive, electrically isolating heat transfer pad with an embedded copper foil which acts as a Faraday shield to decouple unwanted RF interference.
T-Pad 10000 is our most highly efficient interface material which enables smaller heatsinks to be used thus a reduction in weight and ultimately cost.
UniGap 3000 is a highly conformable thermally conductive gap filling pad used to extract heat within motor drive applications where the module can only benefit from conduction cooling.
BondPutty 4000 is a one-part, thermally conductive cure in place adhesive. Once cured the material exhibits excellent vibration dampening properties. Can be used to fill voids, seal and thermally connect hot devices.
Sufficient thermal management in LED lighting can preserve the longevity, increase the reliability and optimise the performance of the design throughout its entire lifetime. Consult our 5 Step LED Lighting Design and Manufacturing Service for more information.
A Universal Science LED module uses products and materials designed specifically for this market place. A module supplied by Universal Science is guaranteed to work every time.
Bondline 700 is designed to bond FR4 to heatsinks enabling electrical isolating a high thermal performance and a permanent structural bond. Available in 3 thicknesses to accommodate differing Copper weights on the FR4.
UniGraph 5000 is a soft and compliant interface material designed to couple metal backed lighting modules printed circuit boards to heatsinks.
Insulated metal printed circuit boards produced by UNiSci offer an alternative method of control heat and enable smaller heatsinks or fewer semiconductors to be used.
T-Pad 6000 is a high thermal conductive interface with guaranteed elec iso suitabnle for coupling devices such as TO247 and TO220.
UniGraph 5000 is a soft and compliant interface material designed to couple metal backed printed circuit boards to heatsinks. Particularly suited for full brick to quarter brick conversion or power conversion products.
Universal Science remains at the forefront of technological advancements in managing heat generated by computer processing units. Our materials enable smaller heatsink designs for portable equipment as well as moving heat efficiently in the design.
UniPhase 3500 is a coating applied to a heatsink, cured in place and is dry to the touch. This enables heatsinks supplied by Universal Science to have its interface material ready for immediate use.
UniGap 1100ES is an exceptionally-soft gap filling material, applying minimal application pressure in combination with a high thermal conductivity.